As the thermal density and total power dissipation of high powered chips continues to increase, more advanced methods of cooling need to be investigated. Since 2012, the high end chip market has begun to very slowly shift towards the use of closed loop liquid cooling. However, nucleate boiling, jet impingement, and spray cooling offer even better cooling performance, but are still highly experimental. Of these methods, immersion nucleate boiling offers many advantages that make it desirable for cooling high powered chips. It is scalable, potentially mitigates chip hot spots, provides high heat transfer performance, and large data centers could see a 50% reduction in energy usage compared to using refrigerated air. Thus, this research focuses on highly scalable surfaces, and advanced composite heat spreaders, to improve the nucleate boiling performance of PF-5060 dielectric liquid with microprocessors cooling in mind.
Arthur's interests including experimental work involving multiphase processes such as boiling and solidification, and numerical model development. He does both experimental work in the laboratory, and computational work which involves code development of numerical models on highly parallel GPUs. Additionally, as a hobby, he built and maintains the ISNPS website.